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ISL84762
Data Sheet November 30, 2004 FN6105.0
Ultra Low ON-Resistance, Low Voltage, Single Supply, Dual SPDT Analog Switch
The Intersil ISL84762 device is a low ON-resistance, low voltage, bidirectional, dual single-pole/double-throw (SPDT) analog switch designed to operate from a single +1.65V to +3.6V supply. Targeted applications include battery powered equipment that benefit from low RON (0.35) and fast switching speeds (tON = 14ns, tOFF = 6ns). The digital logic input is 1.8V logic-compatible when using a single +3V supply. Cell phones, for example, often face ASIC functionality limitations. The number of analog input or GPIO pins may be limited and digital geometries are not well suited to analog switch performance. This part may be used to "mux-in" additional functionality while reducing ASIC design risk. The ISL84762 is offered in small form factor packages, alleviating board space limitations. The ISL84762 is a committed dual single-pole/double-throw (SPDT) that consist of two normally open (NO) and two normally (NC) switches. This configuration can be used as a dual 2-to-1 multiplexer. The ISL84762 is pin compatible with the MAX4762.
TABLE 1. FEATURES AT A GLANCE ISL84762 Number of Switches SW 3V RON 3V tON/tOFF 1.8V RON 1.8V tON/tOFF Packages 2 SPDT or 2-1 MUX 0.35 12ns/5ns 0.55 20ns/8ns 10 Ld 3x3 Thin DFN, 10 Ld MSOP
Features
* Pb-Free Available (RoHS Compliant) (see Ordering Info) * Pin Compatible Replacement for the MAX4762 * ON Resistance (RON) - V+ = +2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.39 - V+ = +1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.55 * RON Matching Between Channels. . . . . . . . . . . . . . . . 0.05 * RON Flatness Across Signal Range . . . . . . . . . . . . . 0.043 * Single Supply Operation. . . . . . . . . . . . . . . . +1.65V to +3.6V * Low Power Consumption (PD . . . . . . . . . . . . . . . . . <0.02W * Fast Switching Action (V+ = +2.7V) - tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14ns - tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6ns * ESD HBM Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >9kV * Guaranteed Break-before-Make * 1.8V Logic Compatible (+3V supply) * Available in 10 lead 3x3 Thin DFN and 10 lead MSOP
Applications
* Battery powered, Handheld, and Portable Equipment - Cellular/mobile Phones - Pagers - Laptops, Notebooks, Palmtops * Portable Test and Measurement * Medical Equipment * Audio and Video Switching
Related Literature
* Technical Brief TB363 "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)" * Application Note AN557 "Recommended Test Procedures for Analog Switches"
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2004. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ISL84762 Pinout
(Note 1) ISL84762 (TDFN, MSOP) TOP VIEW
Ordering Information
PART NO. (BRAND) ISL84762IR (762) ISL84762IR-T (762) ISL84762IU (4762) ISL84762IU-T (4762) ISL84762IRZ (762) (See Note) ISL84762IRZ-T (762) (See Note) PIN NO1 and NO2 OFF ON ISL84762IUZ (4762) (See Note) ISL84762IUZ-T (4762) (See Note) TEMP. RANGE (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 PACKAGE PKG. DWG. #
10 Ld 3x3 Thin DFN L10.3x3A 10 Ld 3x3 Thin DFN L10.3x3A Tape and Reel 10 Ld MSOP 10 Ld MSOP Tape and Reel M10.118 M10.118
V+ 1 NO1 2 COM1 3 NC1 4 IN1 5
10 NO2 9 8 COM2 NC2
7 IN2 6 GND
NOTE: 1. Switches Shown for Logic "0" Input.
10 Ld 3x3 Thin DFN L10.3x3A (Pb-free) 10 Ld 3x3 Thin DFN L10.3x3A Tape and Reel (Pb-free) 10 Ld MSOP (Pb-free) 10 Ld MSOP Tape and Reel (Pb-free) M10.118
-40 to 85
Truth Table
LOGIC 0 1 NOTE: PIN NC1 and NC2 ON OFF
-40 to 85
-40 to 85
M10.118
Logic "0" 0.5V. Logic "1" 1.4V with a 3V supply.
Pin Descriptions
PIN V+ GND IN COM NO NC FUNCTION System Power Supply Input (+1.65V to +3.6V) Ground Connection Digital Control Input Analog Switch Common Pin Analog Switch Normally Open Pin Analog Switch Normally Closed Pin
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C.
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FN6105.0 November 30, 2004
ISL84762
Absolute Maximum Ratings
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 4.7V Input Voltages NO, NC, IN (Note 2). . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V) Output Voltages COM (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V) Continuous Current NO, NC, or COM . . . . . . . . . . . . . . . . . 300mA Peak Current NO, NC, or COM (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . 500mA ESD Rating: HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>9kV MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>500V CDM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV
Thermal Information
Thermal Resistance (Typical) JA (C/W) 10 Ld 3x3 TDFN Package (Note 3) . . . . . . . . . . . . . 110 10 Ld MSOP Package (Note 3) . . . . . . . . . . . . . . . . 190 Maximum Junction Temperature (Plastic Package). . . . . . . . 150C Maximum Storage Temperature Range . . . . . . . . . . . . . -65C to 150C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300C (MSOP - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to 85C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 2. Signals on NC, NO, IN, or COM exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings. 3. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 3V Supply
Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Notes 4, 6), Unless Otherwise Specified TEST CONDITIONS TEMP (C) (NOTE 5) MIN TYP (NOTE 5) MAX UNITS
PARAMETER ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG ON Resistance, RON RON Matching Between Channels, RON RON Flatness, RFLAT(ON) NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) COM ON Leakage Current, ICOM(ON) DYNAMIC CHARACTERISTICS Turn-ON Time, tON Turn-OFF Time, tOFF Break-Before-Make Time Delay, tD Charge Injection, Q OFF Isolation Crosstalk (Channel-to-Channel) Total Harmonic Distortion
Full V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+, See Figure 5 V+ = 2.7V, ICOM = 100mA, VNO or VNC = Voltage at max RON, Note 9 V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+, Note 7 V+ = 3.3V, VCOM = 0.3V, 3V, VNO or VNC = 3V, 0.3V V+ = 3.3V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V, 3V, or Floating 25 Full 25 Full 25 Full 25 Full 25 Full
0 -2 -40 -3 -60
0.39 0.05 0.043 -
V+ 0.6 0.6 0.2 0.2 0.1 0.15 2 40 3 60
V nA nA nA nA
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50, CL = 35pF, See Figure 1, Note 8 V+ = 2.7V, VNO or VNC = 1.5V, RL = 50, CL = 35pF, See Figure 1, Note 8 V+ = 3.3V, VNO or VNC = 1.5V, RL = 50, CL = 35pF, See Figure 3, Note 8 CL = 1.0nF, VG = 0V, RG = 0, See Figure 2 RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS, See Figure 4 RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS, See Figure 6 f = 20Hz to 20kHz, VCOM = 2VP-P, RL = 600 f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7
25 Full 25 Full Full 25 25 25 25 25 25
2 -
14 6 7 95 -68 -95 0.003 115 224
20 25 12 17 -
ns ns ns ns ns pC dB dB % pF pF
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7 COM ON Capacitance, CCOM(ON)
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ISL84762
Electrical Specifications - 3V Supply
Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Notes 4, 6), Unless Otherwise Specified (Continued) TEST CONDITIONS TEMP (C) (NOTE 5) MIN TYP (NOTE 5) MAX UNITS
PARAMETER POWER SUPPLY CHARACTERISTICS Power Supply Range Positive Supply Current, I+
Full V+ = +3.6V, VIN = 0V or V+ 25 Full
1.65 -
3.6 40 750
V nA nA
DIGITAL INPUT CHARACTERISTICS Input Voltage Low, VINL Input Voltage High, VINH Input Current, IINH, IINL NOTES: 4. VIN = input voltage to perform proper function. 5. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 6. Parts are 100% tested at +25C. Limits across the full temperature range are guaranteed by design and correlation. 7. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range. 8. Guaranteed but not tested. 9. RON matching between channels is calculated by subtracting the channel with the highest max Ron value from the channel with lowest max Ron value. V+ = 3.3V, VIN = 0V or V+, Note 8 Full Full Full 1.4 -0.5 0.5 0.5 V V A
Electrical Specifications - 1.8V Supply
Test Conditions: V+ = +1.65V to +2V, GND = 0V, VINH = 1.0V, VINL = 0.4V (Note 4, 6), Unless Otherwise Specified TEST CONDITIONS TEMP (C) Full (NOTE 5) MIN 0 2 1.0 -0.5 TYP 0.55 0.6 22 9 9 49 -68 -95 115 224 (NOTE 5) MAX UNITS V+ 28 33 15 20 0.4 0.5 V ns ns ns ns ns pC dB dB pF pF V V A
PARAMETER ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG ON Resistance, RON DYNAMIC CHARACTERISTICS Turn-ON Time, tON Turn-OFF Time, tOFF Break-Before-Make Time Delay, tD Charge Injection, Q OFF Isolation Crosstalk (Channel-to-Channel)
V+ = 1.8V, ICOM = 100mA, VNO or VNC = 0V to V+, See Figure 5, Note 8
25 Full 25 Full 25 Full Full 25 25 25 25 25 Full Full
V+ = 1.65V, VNO or VNC = 1.0V, RL =50, CL = 35pF, See Figure 1, Note 8 V+ = 1.65V, VNO or VNC = 1.0V, RL =50, CL = 35pF, See Figure 1, Note 8 V+ = 2.0V, VNO or VNC = 1.0V, RL =50, CL = 35pF, See Figure 3, Note 8 CL = 1.0nF, VG = 0V, RG = 0, See Figure 2 RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS, See Figure 4 RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS, See Figure 6 f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7 COM ON Capacitance, CCOM(ON) Input Voltage Low, VINL Input Voltage High, VINH Input Current, IINH, IINL V+ = 2.0V, VIN = 0V or V+, Note 8 DIGITAL INPUT CHARACTERISTICS
Full
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FN6105.0 November 30, 2004
ISL84762 Test Circuits and Waveforms
V+ LOGIC INPUT 50% 0V tOFF SWITCH INPUT VNO 90% SWITCH OUTPUT 0V tON VOUT 90% LOGIC INPUT SWITCH INPUT NO or NC COM IN GND RL 50 CL 35pF VOUT tr < 5ns tf < 5ns V+ C
Logic input waveform is inverted for switches that have the opposite logic sense.
Repeat test for all switches. CL includes fixture and stray capacitance. RL V OUT = V (NO or NC) -----------------------------R L + R ( ON ) FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS FIGURE 1. SWITCHING TIMES
V+
C
RG SWITCH OUTPUT VOUT ON OFF VOUT VG V+ LOGIC INPUT ON 0V
NO or NC
COM
VOUT
GND
IN
CL LOGIC INPUT
Q = VOUT x CL
Repeat test for all switches. FIGURE 2A. MEASUREMENT POINTS FIGURE 2. CHARGE INJECTION FIGURE 2B. TEST CIRCUIT
V+
C
V+ LOGIC INPUT 0V VNX
NO
COM
NC
VOUT RL 50 CL 35pF
IN SWITCH OUTPUT VOUT 90% 0V LOGIC INPUT GND
tD
FIGURE 3A. MEASUREMENT POINTS
Repeat test for all switches. CL includes fixture and stray capacitance. FIGURE 3B. TEST CIRCUIT
FIGURE 3. BREAK-BEFORE-MAKE TIME
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FN6105.0 November 30, 2004
ISL84762 Test Circuits and Waveforms (Continued)
V+ C SIGNAL GENERATOR V+ C
NO or NC
RON = V1/100mA
NO or NC
IN
0V or V+
VNX 100mA V1 IN 0V or V+
ANALYZER RL
COM
GND
COM
GND
Signal direction through switch is reversed, worst case values are recorded. Repeat test for all switches. FIGURE 4. OFF ISOLATION TEST CIRCUIT
Repeat test for all switches. FIGURE 5. RON TEST CIRCUIT
V+ C V+ C SIGNAL GENERATOR
NO or NC COM
50
NO or NC
IN1 0V or V+ IN IMPEDANCE ANALYZER
COM NC or NO
0V or V+
ANALYZER RL
N.C.
COM
GND
GND
Signal direction through switch is reversed, worst case values are recorded. Repeat test for all switches. FIGURE 6. CROSSTALK TEST CIRCUIT
Repeat test for all switches. FIGURE 7. CAPACITANCE TEST CIRCUIT
Detailed Description
The ISL84762 is a bidirectional, dual single pole/double throw (SPDT) analog switch that offers precise switching capability from a single 1.65V to 3.6V supply with low onresistance (0.39) and high speed operation (tON = 14ns, tOFF = 6ns). The device is especially well suited for portable battery powered equipment due to its low operating supply voltage (1.65V), low power consumption (2.7W max), low leakage currents (60nA max), and the tiny Thin DFN and MSOP packages. The ultra low on-resistance and Ron flatness provide very low insertion loss and distortion to applications that require signal reproduction.
Supply Sequencing and Overvoltage Protection
With any CMOS device, proper power supply sequencing is required to protect the device from excessive input currents which might permanently damage the IC. All I/O pins contain ESD protection diodes from the pin to V+ and to GND (see Figure 8). To prevent forward biasing these diodes, V+ must be applied before any input signals, and the input signal voltages must remain between V+ and GND. If these conditions cannot be guaranteed, then one of the following two protection methods should be employed. Logic inputs can easily be protected by adding a 1k resistor in series with the input (see Figure 8). The resistor limits the input current below the threshold that produces permanent damage, and the sub-microamp input current produces an insignificant voltage drop during normal operation.
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FN6105.0 November 30, 2004
ISL84762
This method is not acceptable for the signal path inputs. Adding a series resistor to the switch input defeats the purpose of using a low RON switch, so two small signal diodes can be added in series with the supply pins to provide overvoltage protection for all pins (see Figure 8). These additional diodes limit the analog signal from 1V below V+ to 1V above GND. The low leakage current performance is unaffected by this approach, but the switch signal range is reduced and the resistance may increase, especially at low supply voltages.
Logic-Level Thresholds
This switch family is 1.8V CMOS compatible (0.5V and 1.4V) over a supply range of 2.0V to 3.6V (see Figure 15). At 3.6V the VIH level is about 1.27V. This is still below the 1.8V CMOS guaranteed high output minimum level of 1.4V, but noise margin is reduced. The digital input stages draw supply current whenever the digital input voltage is not at one of the supply rails. Driving the digital input signals from GND to V+ with a fast transition time minimizes power dissipation.
High-Frequency Performance
OPTIONAL PROTECTION DIODE V+ OPTIONAL PROTECTION RESISTOR INX VNO or NC VCOM
In 50 systems, the signal response is reasonably flat even past 30MHz with a -3dB bandwidth of 120MHz (see Figure 16). The frequency response is very consistent over a wide V+ range, and for varying analog signal levels. An OFF switch acts like a capacitor and passes higher frequencies with less attenuation, resulting in signal feedthrough from a switch's input to its output. Off Isolation is the resistance to this feedthrough, while Crosstalk indicates the amount of feedthrough from one switch to another. Figure 17 details the high Off Isolation and Crosstalk rejection provided by this part. At 100kHz, Off Isolation is about 68dB in 50 systems, decreasing approximately 20dB per decade as frequency increases. Higher load impedances decrease Off Isolation and Crosstalk rejection due to the voltage divider action of the switch OFF impedance and the load impedance.
GND OPTIONAL PROTECTION DIODE
FIGURE 8. OVERVOLTAGE PROTECTION
Power-Supply Considerations
The ISL84762 construction is typical of most single supply CMOS analog switches, in that they have two supply pins: V+ and GND. V+ and GND drive the internal CMOS switches and set their analog voltage limits. Unlike switches with a 4V maximum supply voltage, the ISL84762 4.8V maximum supply voltage provides plenty of room for the 10% tolerance of 3.6V supplies, as well as room for overshoot and noise spikes. The minimum recommended supply voltage is 1.65V but the part will operate with a supply below 1.5V. It is important to note that the input signal range, switching times, and onresistance degrade at lower supply voltages. Refer to the electrical specification tables and Typical Performance curves for details. V+ and GND also power the internal logic and level shiftiers. The level shiftiers convert the input logic levels to switched V+ and GND signals to drive the analog switch gate terminals. This family of switches cannot be operated with bipolar supplies, because the input switching point becomes negative in this configuration.
Leakage Considerations
Reverse ESD protection diodes are internally connected between each analog-signal pin and both V+ and GND. One of these diodes conducts if any analog signal exceeds V+ or GND. Virtually all the analog leakage current comes from the ESD diodes to V+ or GND. Although the ESD diodes on a given signal pin are identical and therefore fairly well balanced, they are reverse biased differently. Each is biased by either V+ or GND and the analog signal. This means their leakages will vary as the signal varies. The difference in the two diode leakages to the V+ and GND pins constitutes the analogsignal-path leakage current. All analog leakage current flows between each pin and one of the supply terminals, not to the other switch terminal. This is why both sides of a given switch can show leakage currents of the same or opposite polarity. There is no connection between the analog signal paths and V+ or GND.
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FN6105.0 November 30, 2004
ISL84762 Typical Performance Curves TA = 25C, Unless Otherwise Specified
0.7 ICOM = 100mA 0.6 0.42 0.4 0.5 RON () V+ = 1.8V V+ = 2.7V V+ = 3.6V RON () 0.38 25C 0.36 0.34 -40C 0.32 0.3 0 1 2 VCOM (V) 3 4 85C 0.44 V+ = 2.7V ICOM = 100mA
0.4
0.3
V+ = 3V
0.2
0.1
0
0.5
1
1.5 VCOM (V)
2
2.5
3
FIGURE 9. ON RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE
0.65
FIGURE 10. ON RESISTANCE vs SWITCH VOLTAGE
100 V+ = 1.8V ICOM = 100mA 85C 50
0.6
75 V+ = 3V
0.55 RON () Q (pC)
0.5
25 V+ = 1.8V 0
0.45 25C 0.4 -40C
-25
0.35 0 0.5 1 VCOM (V) 1.5 2
-50
0
0.5
1
1.5 VCOM (V)
2
2.5
3
FIGURE 11. ON RESISTANCE vs SWITCH VOLTAGE
FIGURE 12. CHARGE INJECTION vs SWITCH VOLTAGE
60
14 13
50
12 11
tON (ns)
tOFF (ns)
40
10 9 8 7 85C 25C 6 5 -40C 4 2 2.5 3 V+ (V) 3.5 4 4.5 3 1 1.5 2 2.5 V+ (V) 3 3.5 4 4.5 -40C 25C 85C
30
20
10
1
1.5
FIGURE 13. TURN - ON TIME vs SUPPLY VOLTAGE
FIGURE 14. TURN - OFF TIME vs SUPPLY VOLTAGE
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FN6105.0 November 30, 2004
ISL84762 Typical Performance Curves TA = 25C, Unless Otherwise Specified (Continued)
NORMALIZED GAIN (dB) 1.5 1.4 1.3 1.2 VINH AND VINL (V) 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 1 1.5 2 2.5 V+ (V) 3 3.5 4 4.5 RL = 50 VIN = 0.2VP-P to 2VP-P 1 10 100 FREQUENCY (MHz) VINL VINH V+ = 3V 0 -20 GAIN
PHASE
0 20 40 60 80 PHASE (DEGREES)
100 600
FIGURE 15. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE
FIGURE 16. FREQUENCY RESPONSE
-10 V+ = 3V -20 -30 -40 CROSSTALK (dB) -50 -60 ISOLATION -70 -80 -90 -100 -110 1k 10k 100k 1M 10M CROSSTALK
10 20 30 OFF ISOLATION (dB) 40 50 60 70 80 90 100 110 100M 500M
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP): GND (QFN Paddle Connection: Tie to GND or Float) TRANSISTOR COUNT: 114 PROCESS: Submicron CMOS
FREQUENCY (Hz)
FIGURE 17. CROSSTALK AND OFF ISOLATION
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FN6105.0 November 30, 2004
ISL84762 Thin Dual Flat No-Lead Plastic Package (TDFN)
2X A 0.15 C A D 2X 0.15 C B
L10.3x3A
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL A A1
E
MIN 0.70 -
NOMINAL 0.75 0.20 REF
MAX 0.80 0.05
NOTES -
6 INDEX AREA TOP VIEW B
A3 b D D2 E
// 0.10 C 0.08 C
0.20
0.25 3.00 BSC
0.30
5,8 -
2.20
2.30 3.00 BSC
2.40
7,8 -
E2 e k L L1
1.40
1.50 0.50 BSC
1.60
7,8 -
A C SEATING PLANE SIDE VIEW A3
0.25 0.20 -
0.30 10 5
0.40 0.15
8 1 2 3 Rev. 1 6/04
D2 (DATUM B) 6 INDEX AREA (DATUM A) 1 2 D2/2
7
8
N Nd NOTES:
NX k E2
1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip.
E2/2 NX L N 8 N-1 NX b 5 0.10 M C A B
e (Nd-1)Xe REF. BOTTOM VIEW C L
6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389.
NX (b) 5
(A1) L1 e CC TERMINAL TIP 9L
9. Depending on the method of lead termination at the edge of the package, a maximum 0.15mm pull back (L1) maybe present. L minus L1 to be equal to or greater than 0.3mm. 10. COMPLIANT TO JEDEC MO-229-WEED-3 except for dimensions E2 & D2.
SECTION "C-C"
FOR ODD TERMINAL/SIDE
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FN6105.0 November 30, 2004
ISL84762 Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1 -BE
INCHES SYMBOL MIN 0.037 0.002 0.030 0.007 0.004 0.116 0.116 MAX 0.043 0.006 0.037 0.011 0.008 0.120 0.120 A
ABC
MILLIMETERS MIN 0.94 0.05 0.75 0.18 0.09 2.95 2.95 MAX 1.10 0.15 0.95 0.27 0.20 3.05 3.05 NOTES 9 3 4 6 7 15o 6o Rev. 0 12/02
INDEX AREA
12 TOP VIEW
0.20 (0.008)
A1 A2
4X
0.25 (0.010) GAUGE PLANE SEATING PLANE -CA A2
R1 R
b c D E1
4X
L L1
e E L L1 N R
0.020 BSC 0.187 0.016 10 0.003 0.003 5o 0o 15o 6o 0.199 0.028
0.50 BSC 4.75 0.40 10 0.07 0.07 5o 0o 5.05 0.70
A1
-He D
b
0.10 (0.004) -A0.20 (0.008)
C
SEATING PLANE
0.037 REF
0.95 REF
C a C L E1
C
R1
SIDE VIEW
-B-
0.20 (0.008)
CD
END VIEW
NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension "D" does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E1" does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of "b" dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 11
FN6105.0 November 30, 2004

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